LOW TEMPERATURE NICKELING PROCESS IN SMALL ELECTROLYTE

Description of the project: The deposition of nickel plating is carried out at a reduced temperature from a diluted sulphate-chloride electrolyte of nickel plating, containing malic acid as a buffer additive.

Advantages: Reduced energy and material consumption of the technological process, reduced roughness and increased electrical conductivity of nickel coatings.

The use of the proposed electrolyte and electrolysis conditions makes it possible to reduce the temperature of nickel electrodeposition in comparison with the traditional sulfate-chloride electrolyte by 20-30 ° C, exclude the use of boric acid and reduce the carcinogenic effect of nickel on the human body, and ensure the production of nickel coatings with special properties.