Polyimide composition for protecting crystals of semiconductor devices and integrated circuits

Applications: semiconductor and integrated circuit manufacturing 

Purpose: planarizing and protective coatings for microelectronic devices

Brief essence of the development: polyimide composition for the protection of crystals of semiconductor devices and integrated circuits, consisting of polyamic acid dissolved in dimethylformamide and containing additives of bismaleinimide, aerosil and gadolinium oxide in certain quantities

The main advantages of the development in comparison with analogues: allows to obtain coatings that have higher adhesion to various substrates compared to unfilled polyimide and significantly lower shrinkage during heat treatment of the coating

The main technical characteristics of the development: by reducing the shrinkage of the coating by 10%, the yield of suitable semiconductor devices and integrated circuits reaches 99.7% in comparison with 78.4% for its analog

Forms of intellectual property protection: patent 11322 RB “Polyimide composition for protecting crystals of semiconductor devices and integrated circuits”

Significance for the Republic of Belarus: import substitution

Proposals for cooperation with investors: contract for the performance of works